A three‐dimensional heat transfer and thermal cracking model considering the effect of cracks on heat transfer

C. Yan, H. Zheng, Y. Jiao
International Journal for Numerical and Analytical Methods in Geomechanics
FDEM, Heat conduction, thermal cracking, Thermal stress, thermo‐mechanical coupling model

A simple three‐dimensional heat transfer model is developed to consider the hindering effect of cracks on heat transfer. The 3D heat transfer model can also be applied to numerical methods such as the combined finite‐discrete element method (FDEM), discrete element method (DEM), discontinuous deformation analysis (DDA), the numerical manifold method (NMM), and the finite element method (FEM) to construct thermo‐mechanical coupling models that allow these methods to solve thermal cracking problems and dynamically consider the hindering effect of cracks on heat transfer. In the 3D heat transfer model, the continuous‐discontinuous medium is discretized into independent tetrahedral elements, and joint elements are inserted between adjacent tetrahedral elements. Heat transfer calculations for continuous‐discontinuous media are converted to heat conduction in tetrahedral elements and the heat exchange between the adjacent tetrahedral elements through the joint element. If the joint element between adjacent tetrahedral elements breaks (ie, a crack generates), the heat exchange coefficient of the joint element is reduced to account for the hindering effect of cracks on heat conduction. Then the model and the FDEM are combined to build a thermo‐mechanical coupling model to simulate thermal cracking. The thermally induced deformation, stress, and cracking are investigated by the thermo‐mechanical coupling model, and the numerical results are compared with analytical solutions or experimental results. The 3D heat transfer model and thermo‐mechanical model can provide a powerful tool for simulating heat transfer and thermal cracking in a continuous‐discontinuous medium.

Keywords: FDEM, heat conduction, thermal cracking, thermal stress, thermo‐mechanical coupling model,

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